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This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more.


Master Bond EP21ARLV is a low viscosity epoxy capable of withstanding prolonged exposure to a wide range of acids and chemicals while maintaining excellent electrical insulation.


Master Bond two part epoxy EP62-1AO resists acids, bases and solvents while maintaining excellent strength properties.

Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion.