Dual Curing Polymer Systems

Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements, such as:

  • 用CTE差异粘合类似/不同的基材
  • 最小化热应力
  • Preventing warpage, cracking during temperature fluctuations.

一部分低温热固化环氧树脂的优点和权衡

这些配方提供了所有组分环氧树脂的所有传统优势,因为它们不需要在使用前不需要混合,并且其工作寿命无限制。与需要特殊低温储存的预混合和冷冻系统不同,它们可以方便地存储在传统的冰箱中或环境温度。

All epoxy adhesives reach their peak performance property values after longer exposure to heat at higher temperatures.胶粘剂学院:热固化101andHeat Curing 102videos cover this subject in more details. Although optimal properties are obtained with the higher temperature cure, the lower curing temperature still provides reasonably good physical strength and electrical insulation values. To These systems are compounded to cure at the lowest temperatures for the shortest time periods to facilitate rapid production speeds.

示例:Master Bond Subeplay官网骗人吗preme 3HT-80的典型属性

拉伸剪切强度,铝至铝,75°F 在175°F下30分钟固化 600-800 psi.
拉伸剪切强度,铝至铝,75°F 在250°F下30分钟固化 2,000-200 psi.
拉伸强度,75°F 在175°F下30分钟固化 3000-4,000 psi.
拉伸强度,75°F 在250°F下30分钟固化 7,000-8,000 psi.
T-peel strength, aluminum to aluminum, 75°F 在175°F下30分钟固化 5-10 pli
T-peel strength, aluminum to aluminum, 75°F 在250°F下30分钟固化 20-25 Pli.

只有对所有施用要求的彻底检查都可以确定特定粘合剂化合物的适用性。

两部分低温热固化环氧树脂的益处

Select two component epoxy systems offer exceptionally long working life after mixing and cure at moderately elevated temperatures. For example,Master Bond EP62-1features a greater than 12 hour working life for a 100 gram batch.

最流行的低温热固化粘合剂,密封剂,涂料,灌封和封装化合物

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