导电Adhesive Systems

主键生产一系列导电粘合剂，密封剂和涂层，以满足精确的性能要求。我们的产品系列包括：GydF4y2Ba

• 石墨Filled Electrically Conductive Adhesives
• 镍填充导电粘合剂GydF4y2Ba
• 银涂层/镍填充导电粘合剂GydF4y2Ba
• 银填充导电粘合剂GydF4y2Ba

下图说明了可用于选择具有不同填充物的系统等级的电导率值：GydF4y2Ba

System Type	产品GydF4y2Ba	Filler	粘合体积电阻率GydF4y2Ba
一部分环氧树脂GydF4y2Ba	EP3HTSDA-2GydF4y2Ba	Silver	<0.001 ohm-cm
两部分环氧树脂GydF4y2Ba	EP21TDCS-LO	Silver	<0.001 ohm-cm
两部分环氧树脂GydF4y2Ba	EP79FL.GydF4y2Ba	Silver coated nickel	<0.005 ohm-cm
两部分环氧树脂GydF4y2Ba	EP76M	镍GydF4y2Ba	5-10 ohm-cm
两部分硅胶GydF4y2Ba	Mastersil 155.GydF4y2Ba	石墨GydF4y2Ba	20-40 ohm-cm
一部分硅胶GydF4y2Ba	MasterSil 705S	Silver	<0.01 ohm-cm
Epoxy film	FL901S	Silver	<0.0002欧姆厘米GydF4y2Ba
一部分弹性体GydF4y2Ba	X5G	石墨GydF4y2Ba	5-10 ohm-cm

Chemistries of Master Bond Electrical Conductive Adhesive Systems

主键的导电粘合剂产品系列由环氧树脂，硅氧烷，室温固化弹性体和硅酸钠组成。这些配方的每个主键级别含有不同类型，形状，尺寸，高导电薄片，颗粒，球形，颗粒，为粘合，密封，涂料应用提供低体积电阻率。选择最合适的化学成分以满足粘合剂要求对于获得最理想的性能/加工性能至关重要。beplay官网骗人吗必须仔细考虑粘度/语料，固化机制，固化速度，强度，高/低温可用性，TGydF4y2Ba_GGydF4y2Ba, shelf life, storage etc. in addition to the level of conductivity (volume resistivity). Understanding the tradeoff in values between these different chemistries is vital to satisfying your electronic packaging and assembly needs.

导电Epoxies

High strength paste and film adhesives contain no solvents and are lead free. One part heat curing systems cure rapidly at moderate temperatures, require no mixing, dispense smoothly, streamline processing while avoiding waste. Special grades contain ultra small silver particle sizes, exceptionally thin bond lines, impressive thermal resistance and a volume resistivity of <0.001 ohm-cm. Two part systems offer convenient mix ratios, minimize thermal stress and are well suited to bond heat sensitive substrates. Cures for these products can be accelerated at low temperatures. Flexible and low thermal coefficient of expansion adhesives are designed to adhere well to dissimilar substrates. Fast room temperature formulations set up in 10-20 minutes. Premixed and frozen syringes are available for two component epoxies. These compounds eliminate mixing errors, alleviate waste, are bubble free and ready to use after thawing.

导电环氧膜粘合剂提供均匀的粘合线厚度，在粘合期间挤出挤出和优异的粘合强度。这些B阶段公式具有非凡的韧性，良好的储存稳定性和治疗温度。薄膜可以切成各种形状和尺寸。定制剪切预制件可用于不同配置的光公差。主键膜粘合剂不需要冻结。GydF4y2Ba

导电硅氧烷GydF4y2Ba

在暴露于大气水分时，一个组分非腐蚀性系统在环境温度下固化。粘贴粘度材料具有快速的速度，柔韧性和高耐温性，可用于粘合，垫片，EMI / RFI屏蔽的400°F。低应力化合物粘附得很好地包括其他硅氧烷表面的各种基材。加成固化的两部分系统具有方便的一种混合比，长度的工作寿命，低收缩和在环境温度下的固化，在升高的温度下快速。它们不需要交叉连接空气。系统具有紧密控制的粘度，并提供卓越的防止水分，振动，热循环。beplay苹果版产品具有较高的伸长率，防止腐蚀，具有优异的拉伸强度，可轻松涂上自动分配设备。GydF4y2Ba

室温固化Elastomers

耐用,弹性没有混合系统有一个粘贴莱克阀门e consistency and are highly effective for bonding, EMI/RFI shielding, static dissipation. They feature good peel/shear strength properties. Compositions are well suited for bonding dissimilar substrates. They perform well when exposed to thermal cycling, vibration, shock. Water and chemical resistance is outstanding. Graphite filled product is non-magnetic and has good lubricity.

导电钠硅酸钠GydF4y2Ba

水基系统可提供0°F至700°F。具有成本效益的一个部件系统易于用于粘合，EMI / RFI屏蔽。它作为水分屏障非常有效。beplay苹果版产品用刷子或喷涂到塑料外壳，以保护电子设备免受过度的干扰水平，从而影响其正常运行。主债券提供填充银，石墨和银涂层镍的系统，可提供不同屏蔽效果和导热率。GydF4y2Ba