尺寸稳定的环氧树脂

Master Bond’s dimensionally stable systems are designed for long-term durability and high performance even in extreme environmental conditions. These formulations consist of epoxies, silicones, polyurethanes, polysulfides and UV curable systems.

应用程序of Dimensionally Stable Adhesives and Potting Compounds

Master Bond's dimensionally stable systems are employed in many high tech industries. They can be used in a variety of applications, including:

  • Semiconductor assembly
  • 光电包装
  • Industrial switchgear applications
  • Potting of high voltage sensors

利用这些产品使得终端用户beplay苹果版s to ensure exact positioning/alignments improving quality, enhancing dependability under demanding conditions. Most importantly, filled epoxy adhesive systems have a low degree of shrinkage in comparison to other adhesive systems. While unfilled systems have proven successful in offering low shrinkage, often inorganic fillers have been incorporated in epoxy adhesives to lower shrinkage further. Consideration of stress from thermal expansion mismatches is another factor of significance when selecting a dimensionally stable adhesive.

The table below illustrates the coefficient of thermal expansion, hardness and service temperature range properties that can be achieved for the systems noted:
系统类型 产品 CTE,75°F,x 10-6在/ in /°C 肖氏D硬度,75°F 服务温度范围
两部分环氧树脂 ep30.LTE-LO 15-18 85-95. 4k至250°F(4k至121°C)
一部分紫外线治疗 UV22DC80- 10F 30-35 75-85 -60°F至350°F( - 51°C至177°C)
两部分环氧树脂 EP21TCHT-1 18-21 85-95. 4K至400°F(4K至205°C)
两部分环氧树脂 ep30.-2 40-45 80-90 4K to 300°F (4K to 149°C)
两部分环氧树脂 ep30ns. 30-35 80-90 -60°F to 300°F (-51°C to 149°C)

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