Master Bond has developed many dielectric and conductive surface mount adhesive systems (SMAs) for use in various electronic applications. These can be either one component compounds which cure with heat or two component chemistries which can cure at room temperature. Electrically insulating surface mount adhesives offer excellent bond strength and can hold components in place during solder reflow process. Electrically conductive SMAs are employed in various advanced electronic devices to replace solder.
选择最合适的配方取决于组件，应用条件，固化和加工要求以及分配需求的尺寸/类型。普通应用方法包括丝网印刷和注射器/针头分配。GydF4y2Ba
这些产品不提beplay苹果版供元件放置后的尾翼，有限的流量，防潮，宽的工作温度范围，耐机械冲击和振动的优异性，以及高的物理强度特性。beplay官网骗人吗GydF4y2Ba
主键表面安装粘合剂的性能beplay官网骗人吗性能GydF4y2Ba
Some of the most important performance properties are:
- 导热/电气剥离GydF4y2Ba
- 电气ly conductive
- Consistent dot profile
- Non corrosive
- 空隙填充GydF4y2Ba
- 承受热应力GydF4y2Ba
- No stringing
- 颜色根据需要编码GydF4y2Ba
Learn about oursilver conductive surface mount adhesives designed to replace solder pastes
Common Applications Featuring Master Bond’s Surface Mount Epoxies
这些多功能产品通过领先的电子，汽beplay苹果版车，医疗，航空航天和专业OEM公司广泛使用。它们已成功满足这些组织使用的严格规范和标准。表面贴装粘合剂的自动应用使得能够精确，有效地分配在紧密空间中，使设计工程师具有增强的功能和高收益率的新产品机会。一些例子是：GydF4y2Ba
- Chip on board assemblies
- 一个nalog devices
- X射线和成像设备GydF4y2Ba
- 电光感觉设备GydF4y2Ba
Most Popular Surface Mount Epoxies
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Supreme 3HTND-1SM 一部分，烤箱固化系统（在125-150°C时固化，快速固化。良好的物理性质。beplay官网骗人吗粘贴一致性。建议表面安装。空隙填充。低Ioinic杂质。优越的“绿色”力量。没有弦乐。承受热应力。一致的点谱。 Can be automatically dispensed for high volume applications. Serviceable from -100°F to +350°F. |
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EP21TDCHT.GydF4y2Ba High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties. |
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至高无上的11aoht.GydF4y2Ba 导热，电绝缘的环氧粘合剂。符合MIL-STD-883J第3.5.2节，用于热稳定性。高剥离和剪切强度特性。beplay官网骗人吗非滴水系统。抵抗-100°F至+ 400°F。强化系统。可以承受严格的热循环。方便一度的重量或体积的混合比。在室温下固化。GydF4y2Ba |
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Supreme 3HTND-2DA One component, fast curing die attach adhesive. Excellent die shear strength. Serviceable from -100°F to +400°F. Low ionics. Superior thermal conductivity and electrical insulation properties. Dispenses smoothly without tailing or bleed out. Cures in 5-10 minutes at 150°C. NASA low outgassing approved. Available in syringes. Well suited for automatic dispensing. Performed well in 85°C/85% RH testing. |
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EP17HTDA-1 Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 650°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. TGGydF4y2Baof 230-240°C after post cure. |
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EP3HTSDA-2 银填充导电环氧树脂具有快速固化速度。低体积电阻率和高耐温性。优越的粘合力量。具有令人难以置信的低热电阻的热导电。光滑的粘贴，一致性。可用于兼容各种类型的自动分配器或手动分配的注射器。可从-80°F可维修至+ 450°F。GydF4y2Ba |
